The synopsis for this grant opportunity is detailed below, following
this paragraph. This synopsis contains all of the updates to this
document that have been posted as of
10/06/2011
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Description of Modification
Document Type:
Modification to Previous
Grants Notice
Funding Opportunity Number:
PD-12-7564
Opportunity Category:
Discretionary
Posted Date:
Oct 06, 2011
Creation Date:
Feb 21, 2012
Original Closing Date for Applications:
Feb 07, 2012
Supplement Due Date(s) (due by 5 p.m. proposer's local time):
April 1, Annually REU/RET Supplements
Submission Window Date(s) (due by 5 p.m. proposer's local time):
January 7 - February 7, Annually
September 7 - October 7, Annually
Current Closing Date for Applications:
Oct 07, 2012
Supplement Due Date(s) (due by 5 p.m. proposer's local time):
April 1, Annually REU/RET Supplements
Submission Window Date(s) (due by 5 p.m. proposer's local time):
January 7 - February 7, Annually
September 7 - October 7, Annually
Archive Date:
Funding Instrument Type:
Grant
Category of Funding Activity:
Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
0
Estimated Total Program Funding:
$0
Award Ceiling:
Award Floor:
CFDA Number(s):
47.041
--
Engineering Grants
Cost Sharing or Matching Requirement:
No
Eligible Applicants
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Additional Information on Eligibility:
Agency Name
National Science Foundation
Description
The Communications, Circuits, and Sensing-Systems (CCSS) program is intended to spur visionary systems-oriented activities in collaborative, multidisciplinary, and integrative research. CCSS supports systems research in hardware, signal processing techniques, and architectures to enable the next generation of cyber systems (CPS) that leverage computation, communication, and algorithms integrated with physical domains. CCSS offers new challenges at all levels of systems integration to address future societal needs. CCSS supports innovative research and integrated educational activities in micro- and nano-systems, communications systems, and cyber systems. The goal is to design, develop, and implement new complex and hybrid systems at all scales, including nano, micro, and macro, that lead to innovative engineering principles and solutions for a variety of application domains including, but not limited to, healthcare, medicine, environmental monitoring, communications, disaster mitigation, homeland security, transportation, manufacturing, energy, and smart buildings. CCSS also supports integration technologies at both intra-and inter-chip levels, new and advanced radio frequency (RF), millimeter wave and optical wireless and hybrid communications systems architectures, and sensing and imaging at terahertz (THz) frequencies. Proposals for the CCSS program may involve collaborative research to capture the breadth of expertise needed for such multidisciplinary integrative activities. ECCS will consider supporting a limited number of small team proposals of three or more Investigators from different disciplines and/or universities.Areas of interest include:Lawrence GoldbergRF-Wireless, Optical, and Hybrid Communications Systems Broadband and Low Power Communications RF/Microwave and Millimeter-Wave Components and Circuits Inter- and Intra-Chip Communications and Networking Submillimeter-Wave/Terahertz (THz) Imaging and Sensing Mixed Signal Circuits and Systems Enabling Technologies for Intelligent Communications Systems Interconnects and Packaging TechnologiesKishan BahetiCyber-Physical Systems (CPS) Embedded Systems Wireless Communications Algorithms and Networking Integrated Sensing, Communication, and Computational Systems Signal Processing and Coding Cyber Security Cognitive RadioDominique DagenaisSensors, Actuators, and Electronic Interfaces Chemical, Biological, and Physical Diagnostic Systems Implantable and Wearable Systems Environmental Sensing and Monitoring MEMS/NEMS Devices System Level Fabrication, Packaging, and Assembly
The following files represent the modifications to this synopsis
with the changes noted within the documents. The list of files is
arranged from newest to oldest with the newest file representing the
current synopsis. Changed sections from the previous document are shown
in a light grey background.
