The synopsis for this grant opportunity is detailed below, following
this paragraph. This synopsis contains all of the updates to this
document that have been posted as of
06/07/2012
. If
updates have been made to the opportunity synopsis, update information
is provided below the synopsis.
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Description of Modification
Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document.
Document Type:
Modification to Previous
Grants Notice
Funding Opportunity Number:
DARPA-BAA-12-50
Opportunity Category:
Discretionary
Posted Date:
Jun 07, 2012
Creation Date:
Jul 19, 2012
Original Closing Date for Applications:
Aug 30, 2012
Current Closing Date for Applications:
Sep 13, 2012
Archive Date:
Mar 14, 2013
Funding Instrument Type:
Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity:
Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Estimated Total Program Funding:
Award Ceiling:
$0
Award Floor:
$0
CFDA Number(s):
12.910
--
Research and Technology Development
Cost Sharing or Matching Requirement:
No
Eligible Applicants
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Additional Information on Eligibility:
Agency Name
DARPA - Microsystems Technology Office
Description
Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document.
Original Synopsis below.
The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniquesneeded to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached.
The following files represent the modifications to this synopsis
with the changes noted within the documents. The list of files is
arranged from newest to oldest with the newest file representing the
current synopsis. Changed sections from the previous document are shown
in a light grey background.
