The synopsis for this grant opportunity is detailed below, following
this paragraph. This synopsis contains all of the updates to this
document that have been posted as of
04/23/2009
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Document Type:
Grants Notice
Funding Opportunity Number:
DARPA-BAA-09-44
Opportunity Category:
Discretionary
Posted Date:
Apr 23, 2009
Creation Date:
Apr 23, 2009
Original Closing Date for Applications:
Apr 22, 2010
Dates
Posting Date: April 23, 2009
Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time
First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time
Current Closing Date for Applications:
Apr 22, 2010
Dates
Posting Date: April 23, 2009
Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time
First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time
Archive Date:
May 14, 2010
Funding Instrument Type:
Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity:
Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Estimated Total Program Funding:
Award Ceiling:
$0
Award Floor:
$0
CFDA Number(s):
12.910
--
Research and Technology Development
Cost Sharing or Matching Requirement:
No
Eligible Applicants
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Additional Information on Eligibility:
Agency Name
DARPA - Microsystems Technology Office
Description
DARPA is soliciting innovative research proposals in the area of active cooling modules. DoD systems are driving conflicting needs for high performance as well as reduced size and weight. DARPA makes many investments in new technologies that can improve performance or reduce size and weight. Unfortunately, in many cases, the power consumption of these systems increases with each improvement. As a result, the performance of heat rejection technology remains a key limitation in many applications.
The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide tens of degrees of cooling for 100W devices in cm-scale cooling modules with coefficient of performance (COP) of 3 or better.
All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. E-mail: DARPA-BAA-09-44@darpa.mil; PHONE: (703) 351-8427 for administrative/TFIMS questions; PHONE: (703) 351-8573 for technical questions. DARPA intends to use electronic mail for correspondence regarding DARPA-BAA-09-44.
See the full BAA document attached.
